Part Number Hot Search : 
AT54C 60UP40S3 RB0806 BD902 PTU4005 RBC2725 B1000 3391T
Product Description
Full Text Search
 

To Download 93C86 Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
  ? 1996-2012 microchip technology inc. ds21132f-page 1 93c76/86 features: ? single 5.0v supply ? low-power cmos technology - 1 ma active current typical ? org pin selectable memory configuration 1024 x 8- or 512 x 16-bit organization (93c76) 2048 x 8- or 1024 x 16-bit organization (93C86) ? self-timed erase and write cycles (including auto-erase) ? automatic eral before wral ? power on/off data protection circuitry ? industry standard 3-wire serial i/o ? device status signal during erase/write cycles ? sequential read function ? 1,000,000 erase/write cycles ensured ? data retention > 200 years ? 8-pin pdip/soic package ? temperature ranges supported description: the microchip technology inc. 93c76/86 are 8k and 16k low voltage serial electrically erasable proms. the device memory is configured as x8 or x16 bits depending on the org pin setup. advanced cmos technology makes these devices ideal for low power nonvolatile memory applications. these devices also have a program enable (pe) pin to allow the user to write protect the entire contents of the memory array. the 93c76/86 is available in standard 8-pin pdip and 8-pin surface mount soic packages. package types block diagram - commercial (c): 0c to +70c - industrial (i): -40c to +85c - automotive (e) -40c to +125c soic package pdip package cs clk di do v ss pe v cc org cs clk di do v cc pe org v ss 93c76/86 93c76/86 1 2 3 4 8 7 6 5 1 2 3 4 8 7 6 5 do cs clk v cc v ss memory array address decoder data register counter address output buffer mode decode logic generator clock di pe 8k/16k 5.0v microwire serial eeprom not recommended for new designs ? please use 93lc76c or 93lc86c.
93c76/86 ds21132f-page 2 ? 1996-2012 microchip technology inc. 1.0 electrical characteristics absolute maximum ratings (?) v cc ............................................................................................................................... ..............................................7.0v all inputs and outputs w.r.t. v ss ........................................................................................................ -0.6v to vcc + 1.0v storage temperature ............................................................................................................ ...................-65c to +150c ambient temperature with power applied ......................................................................................... .......-40c to +125c soldering temperature of leads (10 seconds) .................................................................................... ...................+300c esd protection on all pins ..................................................................................................... .....................................4 kv 1.1 ac test conditions ? notice: stresses above those listed under ?absolute maximum ratings? may cause permanent damage to the device. this is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational listings of this specification is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. ac waveform: v lo = 2.0v v hi = vcc - 0.2v (note 1) v hi = 4.0v for (note 2) timing measurement reference level input 0.5 v cc output 0.5 v cc note 1: for v cc ? 4.0v 2: for v cc > 4.0v
? 1996-2012 microchip technology inc. ds21132f-page 3 93c76/86 table 1-1: dc characteristics table 1-2: ac characteristics dc characteristics applicable over recommended operating ranges shown below unless otherwise noted: v cc = +4.5v to +5.5v commercial (c): t a = 0c to -40c industrial (i): t a = -40c to +85c automotive (e): t a = -40 ? c to +125 ? c parameter symbol min. max. units conditions high-level input voltage v ih1 2.0 v cc +1 v ? low-level input voltage v il1 -0.3 0.8 v ? low-level output voltage v ol1 ?0.4vi ol = 2.1 ma; v cc = 4.5v v ol2 ?0.2vi ol =100 ? a; v cc = 4.5v high-level output voltage v oh1 2.4 ? v i oh = -400 ? a; v cc = 4.5v v oh2 v cc -0.2 ? v i oh = -100 ? a; v cc = 4.5v. input leakage current i li -10 10 ? av in = 0.1v to v cc output leakage current i lo -10 10 ? av out = 0.1v to v cc pin capacitance (all inputs/outputs) c int ?7pf (note 1) t a = +25c, f clk = 1 mhz operating current i cc write ? 3 ma f clk = 2 mhz; v cc = 5.5v i cc read ? 1.5 ma f clk = 2 mhz; v cc = 5.5v standby current i ccs ?100 ? aclk = cs = 0v; v cc = 5.5v di = pe = v ss org = v ss or v cc note 1: this parameter is periodically sampled and not 100% tested. ac characteristics applicable over recommended operating ranges shown below unless otherwise noted: v cc = +4.5v to +5.5v commercial (c): t a = 0c to -40c industrial (i): t a = -40c to +85c automotive (e): t a = -40 ? c to +125 ? c parameter symbol min. max. units conditions clock frequency f clk ? 2 mhz vcc ? 4.5v clock high time t ckh 300 ? ns clock low time t ckl 200 ? ns chip select setup time t css 50 ? ns relative to clk chip select hold time t csh 0?ns chip select low time t csl 250 ? ns relative to clk data input setup time t dis 100 ? ns relative to clk data input hold time t dih 100 ? ns relative to clk data output delay time t pd ? 400 ns c l = 100 pf data output disable time t cz ? 100 ns (note 1) status valid time t sv ? 500 ns c l = 100 pf program cycle time t wc ? 10 ms erase/write mode (note 2) t ec ? 15 ms eral mode t wl ?30mswral mode endurance ? 1m ? cycles 25c, v cc = 5.0v, block mode (note 3) note 1: this parameter is periodically sampled and not 100% tested. 2: typical program cycle is 4 ms per word. 3: this parameter is not tested but ensured by characterization. for endurance estimates in a specific application, please consult the total endurance ? model which can be obtained from microchip?s web site at www.microchip.com.
93c76/86 ds21132f-page 4 ? 1996-2012 microchip technology inc. table 1-3: instruction set for 93c76: org=1 (x16 organization) table 1-4: instruction set for 93c76: org=0 (x8 organization) table 1-5: instruction set for 93C86: org=1 (x16 organization) table 1-6: instruction set for 93C86: org=0 (x8 organization) instruction sb opcode address data in data out req. clk cycles read 1 10 x a8 a7 a6 a5 a4 a3 a2 a1 a0 ? d15 - d0 29 ewen 1 00 1 1 x x x x x x x x ? high-z 13 erase 1 11 x a8 a7 a6 a5 a4 a3 a2 a1 a0 ? (rdy/bsy) 13 eral 1 00 1 0 x x x x x x x x ? (rdy/bsy) 13 write 1 01 x a8 a7 a6 a5 a4 a3 a2 a1 a0 d15 - d0 (rdy/bsy) 29 wral 1 00 0 1 x x x x x x x x d15 - d0 (rdy/bsy) 29 ewds 1 00 0 0 x x x x x x x x ? high-z 13 instruction sb opcode address data in data out req. clk cycles read 1 10 x a9 a8 a7 a6 a5 a4 a3 a2 a1 a0 ? d7 - d0 22 ewen 1 00 1 1 x x x x x x x x x ? high-z 14 erase 1 11 x a9 a8 a7 a6 a5 a4 a3 a2 a1 a0 ? (rdy/bsy) 14 eral 1 00 1 0 x x x x x x x x x ? (rdy/bsy) 14 write 1 01 x a9 a8 a7 a6 a5 a4 a3 a2 a1 a0 d7 - d0 (rdy/bsy) 22 wral 1 00 0 1 x x x x x x x x x d7 - d0 (rdy/bsy) 22 ewds 1 00 0 0 x x x x x x x x x ? high-z 14 instruction sb opcode address data in data out req. clk cycles read 1 10 a9 a8 a7 a6 a5 a4 a3 a2 a1 a0 ? d15 - d0 29 ewen 1 00 1 1 x x x x x x x x ? high-z 13 erase 1 11 a9 a8 a7 a6 a5 a4 a3 a2 a1 a0 ? (rdy/bsy) 13 eral 1 00 1 0 x x x x x x x x ? (rdy/bsy) 13 write 1 01 a9 a8 a7 a6 a5 a4 a3 a2 a1 a0 d15 - d0 (rdy/bsy) 29 wral 1 00 0 1 x x x x x x x x d15 - d0 (rdy/bsy) 29 ewds 1 00 0 0 x x x x x x x x ? high-z 13 instruction sb opcode address data in data out req. clk cycles read 1 10 a10 a9 a8 a7 a6 a5 a4 a3 a2 a1 a0 ? d7 - d0 22 ewen 1 00 1 1 x x x x x x x x x ? high-z 14 erase 1 11 a10 a9 a8 a7 a6 a5 a4 a3 a2 a1 a0 ? (rdy/bsy) 14 eral 1 00 1 0 x x x x x x x x x ? (rdy/bsy) 14 write 1 01 a10 a9 a8 a7 a6 a5 a4 a3 a2 a1 a0 d7 - d0 (rdy/bsy) 22 wral 1 00 0 1 x x x x x x x x x d7 - d0 (rdy/bsy) 22 ewds 1 00 0 0 x x x x x x x x x ? high-z 14
? 1996-2012 microchip technology inc. ds21132f-page 5 93c76/86 2.0 principles of operation when the org pin is connected to v cc , the x16 orga- nization is selected. when it is connected to ground, the x8 organization is selected. instructions, addresses and write data are clocked into the di pin on the rising edge of the clock (clk). the do pin is normally held in a high-z state except when reading data from the device, or when checking the ready/busy status during a programming operation. the ready/busy status can be verified during an erase/write operation by polling the do pin; do low indicates that program- ming is still in progress, while do high indicates the device is ready. the do will enter the high-impedance state on the falling edge of the cs. 2.1 start condition the start bit is detected by the device if cs and di are both high with respect to the positive edge of clk for the first time. before a start condition is detected, cs, clk and di may change in any combination (except to that of a start condition), without resulting in any device opera- tion (read, write, erase, ewen, ewds, eral and wral). as soon as cs is high, the device is no longer in the standby mode. an instruction following a start condition will only be executed if the required amount of opcode, address and data bits for any particular instruction are clocked in. after execution of an instruction (i.e., clock in or out of the last required address or data bit) clk and di become ?don't care? bits until a new start condition is detected. 2.2 di/do it is possible to connect the data in and data out pins together. however, with this configuration it is possible for a ?bus conflict? to occur during the ?dummy zero? that precedes the read operation, if a0 is a logic high level. under such a condition the voltage level seen at data out is undefined and will depend upon the relative impedances of data out and the signal source driving a0. the higher the current sourcing capability of a0, the higher the voltage at the data out pin. 2.3 erase/write enable and disable (ewen, ewds) the 93c76/86 powers up in the erase/write disable (ewds) state. all programming modes must be preceded by an erase/write enable ( ewen ) instruction. once the ewen instruction is executed, programming remains enabled until an ewds instruction is executed or v cc is removed from the device. to protect against accidental data disturb, the ewds instruction can be used to disable all erase/write functions and should follow all programming operations. execution of a read instruction is independent of both the ewen and ewds instructions. 2.4 data protection during power-up, all programming modes of operation are inhibited until v cc has reached a level greater than 1.4v. during power-down, the source data protection circuitry acts to inhibit all programming modes when v cc has fallen below 1.4v. the ewen and ewds commands give additional protection against accidentally programming during normal operation. after power-up, the device is automatically in the ewds mode. therefore, an ewen instruction must be performed before any erase or write instruction can be executed.
93c76/86 ds21132f-page 6 ? 1996-2012 microchip technology inc. 3.0 device operation 3.1 read the read instruction outputs the serial data of the addressed memory location on the do pin. a dummy zero bit precedes the 16-bit (x16 organization) or 8-bit (x8 organization) output string. the output data bits will toggle on the rising edge of the clk and are stable after the specified time delay (t pd ). sequential read is possible when cs is held high and clock transitions continue. the memory address pointer will automati- cally increment and output data sequentially. 3.2 erase the erase instruction forces all data bits of the specified address to the logical ? 1 ? state. the self-timed programming cycle is initiated on the rising edge of clk as the last address bit (a0) is clocked in. at this point, the clk, cs and di inputs become ?don?t cares?. the do pin indicates the ready/busy status of the device if the cs is high. the ready/busy status will be displayed on the do pin until the next start bit is received as long as cs is high. bringing the cs low will place the device in standby mode and cause the do pin to enter the high-impedance state. do at logical ? 0 ? indicates that programming is still in progress. do at logical ? 1 ? indicates that the register at the specified address has been erased and the device is ready for another instruction. the erase cycle takes 3 ms per word (typical). 3.3 write the write instruction is followed by 16 bits (or by 8 bits) of data to be written into the specified address. the self-timed programming cycle is initiated on the rising edge of clk as the last data bit (d0) is clocked in. at this point, the clk, cs and di inputs become ?don?t cares?. the do pin indicates the ready/busy status of the device if the cs is high. the ready/busy status will be displayed on the do pin until the next start bit is received as long as cs is high. bringing the cs low will place the device in standby mode and cause the do pin to enter the high-impedance state. do at logical ? 0 ? indicates that programming is still in progress. do at logical ? 1 ? indicates that the register at the specified address has been written and the device is ready for another instruction. the write cycle takes 3 ms per word (typical). 3.4 erase all (eral) the eral instruction will erase the entire memory array to the logical ? 1 ? state. the eral cycle is identical to the erase cycle except for the different opcode. the eral cycle is completely self-timed and commences on the rising edge of the last address bit (a0). note that the least significant 8 or 9 address bits are "don?t care" bits, depending on selection of x16 or x8 mode. clock- ing of the clk pin is not necessary after the device has entered the self clocking mode. the eral instruction is ensured at vcc = +4.5v to +5.5v. the do pin indicates the ready/busy status of the device if the cs is high. the ready/busy status will be displayed on the do pin until the next start bit is received as long as cs is high. bringing the cs low will place the device in standby mode and cause the do pin to enter the high-impedance state. do at logical ? 0 ? indicates that programming is still in progress. do at logical ? 1 ? indicates that the entire device has been erased and is ready for another instruction. the eral cycle takes 15 ms maximum (8 ms typical). 3.5 write all (wral) the wral instruction will write the entire memory array with the data specified in the command. the wral cycle is completely self-timed and commences on the rising edge of the last address bit (a0). note that the least significant 8 or 9 address bits are ?don?t cares?, depending on selection of x16 or x8 mode. clocking of the clk pin is not necessary after the device has entered the self clocking mode. the wral command does include an automatic eral cycle for the device. therefore, the wral instruction does not require an eral instruction but the chip must be in the ewen status. the wral instruction is ensured at vcc = +4.5v to +5.5v. the do pin indicates the ready/busy status of the device if the cs is high. the ready/busy status will be displayed on the do pin until the next start bit is received as long as cs is high. bringing the cs low will place the device in standby mode and cause the do pin to enter the high-impedance state. do at logical ? 0 ? indicates that programming is still in progress. do at logical ? 1 ? indicates that the entire device has been written and is ready for another instruction. the wral cycle takes 30 ms maximum (16 ms typical).
? 1996-2012 microchip technology inc. ds21132f-page 7 93c76/86 figure 3-1: synchronous data timing figure 3-2: read figure 3-3: ewen the memory automatically cycles to the next register. v ih v il v ih v il v ih v oh v ol v oh v ol v il t sv t dis t pd t dih t css t ckh t ckl t pd t csh t cz t cz cs clk di do do (program) (read) status valid 110 a n a 0 d n d n d 0 d 0 ... ... ... high-impedance t csl cs clk di do 0 ewen cs clk di 111 00 t csl xx ... org = v cc , 8 x?s org = v ss , 9 x?s
93c76/86 ds21132f-page 8 ? 1996-2012 microchip technology inc. figure 3-4: ewds figure 3-5: write figure 3-6: wral 10000x x ... cs clk di t csl org = v cc , 8 x?s org = v ss , 9 x?s 101 a n a 0 ... d n ... d 0 t wc ready busy high-impedance cs clk di do standby t cz ensure at vcc = +4.5v to +5.5v. 10001x ... x d n ... d 0 busy ready high-impedance standby cs clk di do org = v cc , 8 x?s org = v ss , 9 x?s t wl t cz
? 1996-2012 microchip technology inc. ds21132f-page 9 93c76/86 figure 3-7: erase figure 3-8: eral 11 1 a n ... a 0 t cz high-impedance cs clk di do standby ready busy t wc ... ensure at v cc = +4.5v to +5.5v. org = v cc , 8 x?s org = v ss , 9 x?s 10 010x x ... cs clk di do t ec t cz high-impedance busy ready standby
93c76/86 ds21132f-page 10 ? 1996-2012 microchip technology inc. 4.0 pin descriptions table 4-1: pin function table 4.1 chip select (cs) a high level selects the device. a low level deselects the device and forces it into standby mode. however, a programming cycle which is already initiated will be completed, regardless of the cs input signal. if cs is brought low during a program cycle, the device will go into standby mode as soon as the programming cycle is completed. cs must be low for 250 ns minimum (t csl ) between consecutive instructions. if cs is low, the internal control logic is held in a reset status. 4.2 serial clock (clk) the serial clock is used to synchronize the communi- cation between a master device and the 93c76/86. opcode, address and data bits are clocked in on the positive edge of clk. data bits are also clocked out on the positive edge of clk. clk can be stopped anywhere in the transmission sequence (at high or low level) and can be continued anytime with respect to clock high time (t ckh ) and clock low time (t ckl ). this gives the controlling master freedom in preparing opcode, address and data. clk is a ?don't care? if cs is low (device deselected). if cs is high, but start condition has not been detected, any number of clock cycles can be received by the device without changing its status (i.e., waiting for start condition). clk cycles are not required during the self-timed write (i.e., auto erase/write) cycle. after detection of a start condition the specified number of clock cycles (respectively low-to-high transitions of clk) must be provided. these clock cycles are required to clock in all opcode, address, and data bits before an instruction is executed (see table 1-3 through table 1-6 for more details). clk and di then become don't care inputs waiting for a new start condition to be detected. 4.3 data in (di) data in is used to clock in a start bit, opcode, address and data synchronously with the clk input. 4.4 data out (do) data out is used in the read mode to output data synchronously with the clk input (t pd after the positive edge of clk). this pin also provides ready/busy status information during erase and write cycles. ready/busy status information is available when cs is high. it will be displayed until the next start bit occurs as long as cs stays high. 4.5 organization (org) when org is connected to v cc , the x16 memory organization is selected. when org is tied to v ss , the x8 memory organization is selected. there is an internal pull-up resistor on the org pin that will select x16 organization when left unconnected. 4.6 program enable (pe) this pin allows the user to enable or disable the ability to write data to the memory array. if the pe pin is floated or tied to v cc , the device can be programmed. if the pe pin is tied to v ss , programming will be inhibited. there is an internal pull-up on this device that enables programming if this pin is left floating. name function cs chip select clk serial data clock di serial data input do serial data output v ss ground org memory configuration pe program enable v cc power supply note: cs must go low between consecutive instructions, except when performing a sequential read (refer to section 3.1 ?read? for more detail on sequential reads).
? 1996-2012 microchip technology inc. ds21132f-page 11 93c76/86 5.0 packaging information 5.1 package marking information xxxxxnnn 8-lead pdip xxxxxxxx yyww 017 example 93c76 0410 8-lead soic (.150?) xxxxxxxx xxxxyyww nnn example 93C86 /sn0410 017 legend: xx...x customer-specific information y year code (last digit of calendar year) yy year code (last 2 digits of calendar year) ww week code (week of january 1 is week ?01?) nnn alphanumeric traceability code pb-free jedec designator for matte tin (sn) * this package is pb-free. the pb-free jedec designator ( ) can be found on the outer packaging for this package. note : in the event the full microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e
93c76/86 ds21132f-page 12 ? 1996-2012 microchip technology inc. 8-lead plastic dual in-line (p) ? 300 mil body (pdip) b1 b a1 a l a2 p ? e eb ? c e1 n d 1 2 units inches* millimeters dimension limits min nom max min nom max number of pins n 88 pitch p .100 2.54 top to seating plane a .140 .155 .170 3.56 3.94 4.32 molded package thickness a2 .115 .130 .145 2.92 3.30 3.68 base to seating plane a1 .015 0.38 shoulder to shoulder width e .300 .313 .325 7.62 7.94 8.26 molded package width e1 .240 .250 .260 6.10 6.35 6.60 overall length d .360 .373 .385 9.14 9.46 9.78 tip to seating plane l .125 .130 .135 3.18 3.30 3.43 lead thickness c .008 .012 .015 0.20 0.29 0.38 upper lead width b1 .045 .058 .070 1.14 1.46 1.78 lower lead width b .014 .018 .022 0.36 0.46 0.56 overall row spacing eb .310 .370 .430 7.87 9.40 10.92 mold draft angle top ? 51015 51015 mold draft angle bottom ? 51015 51015 * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed jedec equivalent: ms-001 drawing no. c04-018 .010? (0.254mm) per side. significant characteristic note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging
? 1996-2012 microchip technology inc. ds21132f-page 13 93c76/86 8-lead plastic small outline (sn) ? narrow, 150 mil body (soic) foot angle ? 048048 15 12 0 15 12 0 ? mold draft angle bottom 15 12 0 15 12 0 ? mold draft angle top 0.51 0.42 0.33 .020 .017 .013 b lead width 0.25 0.23 0.20 .010 .009 .008 c lead thickness 0.76 0.62 0.48 .030 .025 .019 l foot length 0.51 0.38 0.25 .020 .015 .010 h chamfer distance 5.00 4.90 4.80 .197 .193 .189 d overall length 3.99 3.91 3.71 .157 .154 .146 e1 molded package width 6.20 6.02 5.79 .244 .237 .228 e overall width 0.25 0.18 0.10 .010 .007 .004 a1 standoff 1.55 1.42 1.32 .061 .056 .052 a2 molded package thickness 1.75 1.55 1.35 .069 .061 .053 a overall height 1.27 .050 p pitch 8 8 n number of pins max nom min max nom min dimension limits millimeters inches* units 2 1 d n p b e e1 h l ? c 45 ? ? a2 ? a a1 * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed .010? (0.254mm) per side. jedec equivalent: ms-012 drawing no. c04-057 significant characteristic note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging
93c76/86 ds21132f-page 14 ? 1996-2012 microchip technology inc. appendix a: revision history revision e added note to page 1 header (not recommended for new designs). added section 5.0: package marking information. added on-line support page. updated document format. revision f added a note to each package outline drawing.
? 1996-2012 microchip technology inc. ds21132f-page 15 93c76/86 the microchip web site microchip provides online support via our www site at www.microchip.com . this web site is used as a means to make files and information easily available to customers. accessible by using your favorite internet browser, the web site contains the following information: ? product support ? data sheets and errata, application notes and sample programs, design resources, user?s guides and hardware support documents, latest software releases and archived software ? general technical support ? frequently asked questions (faq), technical support requests, online discussion groups, microchip consultant program member listing ? business of microchip ? product selector and ordering guides, latest microchip press releases, listing of seminars and events, listings of microchip sales offices, distributors and factory representatives customer change notification service microchip?s customer notification service helps keep customers current on microchip products. subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. to register, access the microchip web site at www.microchip.com . under ?support?, click on ?customer change notification? and follow the registration instructions. customer support users of microchip products can receive assistance through several channels: ? distributor or representative ? local sales office ? field application engineer (fae) ? technical support customers should contact their distributor, representative or field application engineer (fae) for support. local sales offices are also available to help customers. a listing of sales offices and locations is included in the back of this document. technical support is available through the web site at: http://microchip.com/support
93c76/86 ds21132f-page 16 ? 1996-2012 microchip technology inc. reader response it is our intention to provide you with the best documentation possible to ensure successful use of your microchip product. if you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please fax your comments to the technical publications manager at (480) 792-4150. please list the following information, and use this outline to provide us with your comments about this document. to: technical publications manager re: reader response total pages sent ________ from: name company address city / state / zip / country telephone: (_______) _________ - _________ application (optional): would you like a reply? y n device: literature number: questions: fax: (______) _________ - _________ ds21132f 93c76/86 1. what are the best features of this document? 2. how does this document meet your hardware and software development needs? 3. do you find the organization of this document easy to follow? if not, why? 4. what additions to the document do you think would enhance the structure and subject? 5. what deletions from the document could be made without affecting the overall usefulness? 6. is there any incorrect or misleading information (what and where)? 7. how would you improve this document?
? 1996-2012 microchip technology inc. ds21132f-page 17 93c76/86 product identification system to order or obtain information, e. g., on pricing or delivery, refer to the factory or the listed sales office . sales and support part no. x /xx xxx pattern package temperature range device device 93c76/86: microwire serial eeprom 93c76t/86t: microwire serial eeprom (tape and reel) temperature range blank = 0 ? c to +70 ? c i= -40 ? c to +85 ? c e=-40 ? c to +125 ? c package p = plastic dip (300 mil body), 8-lead sn = plastic soic (150 mil body), 8-lead data sheets products supported by a preliminary data sheet may have an errata sheet describing minor operational differences and recommended workarounds. to determine if an errata sheet exists for a particular device, please contact one of the following: 1. your local microchip sales office 2. the microchip worldwide site (www.microchip.com) please specify which device, revision of silicon and data sheet (include literature #) you are using. new customer notification system register on our web site (www.microchip.com/cn) to receive the most current information on our products.
93c76/86 ds21132f-page 18 ? 1996-2012 microchip technology inc. notes:
? 1996-2012 microchip technology inc. ds21132f-page 19 information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application meets with your specifications. microchip makes no representations or warranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchip devices in life support and/or safety applications is entirely at the buyer?s risk, and the buyer agrees to defend, indemnify and hold harmless microchip from any and all damages, claims, suits, or expenses resulting from such use. no licenses are conveyed, implicitly or otherwise, under any microchip intellectual property rights. trademarks the microchip name and logo, the microchip logo, dspic, flashflex, k ee l oq , k ee l oq logo, mplab, pic, picmicro, picstart, pic 32 logo, rfpic, sst, sst logo, superflash and uni/o are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. filterlab, hampshire, hi-tech c, linear active thermistor, mtp, seeval and the embedded control solutions company are registered trademarks of microchip technology incorporated in the u.s.a. silicon storage technology is a registered trademark of microchip technology inc. in other countries. analog-for-the-digital age, app lication maestro, bodycom, chipkit, chipkit logo, codeguard, dspicdem, dspicdem.net, dspicworks, dsspeak, ecan, economonitor, fansense, hi-tide, in-circuit serial programming, icsp, mindi, miwi, mpasm, mpf, mplab certified logo, mplib, mplink, mtouch, omniscient code generation, picc, picc-18, picdem, picdem.net, pickit, pictail, real ice, rflab, select mode, sqi, serial quad i/o, total endurance, tsharc, uniwindriver, wiperlock, zena and z-scale are trademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of microchip technology incorporated in the u.s.a. gestic and ulpp are registered trademarks of microchip technology germany ii gmbh & co. & kg, a subsidiary of microchip technology inc., in other countries. all other trademarks mentioned herein are property of their respective companies. ? 1996-2012, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. isbn: 9781620767412 note the following details of the code protection feature on microchip devices: ? microchip products meet the specification cont ained in their particular microchip data sheet. ? microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions. ? there are dishonest and possibly illegal methods used to breach the code protection feature. all of these methods, to our knowledge, require using the microchip produc ts in a manner outside the operating specif ications contained in microchip?s data sheets. most likely, the person doing so is engaged in theft of intellectual property. ? microchip is willing to work with the customer who is concerned about the integrity of their code. ? neither microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as ?unbreakable.? code protection is constantly evolving. we at microchip are co mmitted to continuously improvin g the code protection features of our products. attempts to break microchip?s code protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona; gresham, oregon and design centers in california and india. the company?s quality system processes and procedures are for its pic ? mcus and dspic ? dscs, k ee l oq ? code hopping devices, serial eeproms, microperipherals, nonvolatile memory and analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001:2000 certified. quality management s ystem certified by dnv == iso/ts 16949 ==
ds21132f-page 20 ? 1996-2012 microchip technology inc. americas corporate office 2355 west chandler blvd. chandler, az 85224-6199 tel: 480-792-7200 fax: 480-792-7277 technical support: http://www.microchip.com/ support web address: www.microchip.com atlanta duluth, ga tel: 678-957-9614 fax: 678-957-1455 boston westborough, ma tel: 774-760-0087 fax: 774-760-0088 chicago itasca, il tel: 630-285-0071 fax: 630-285-0075 cleveland independence, oh tel: 216-447-0464 fax: 216-447-0643 dallas addison, tx tel: 972-818-7423 fax: 972-818-2924 detroit farmington hills, mi tel: 248-538-2250 fax: 248-538-2260 indianapolis noblesville, in tel: 317-773-8323 fax: 317-773-5453 los angeles mission viejo, ca tel: 949-462-9523 fax: 949-462-9608 santa clara santa clara, ca tel: 408-961-6444 fax: 408-961-6445 toronto mississauga, ontario, canada tel: 905-673-0699 fax: 905-673-6509 asia/pacific asia pacific office suites 3707-14, 37th floor tower 6, the gateway harbour city, kowloon hong kong tel: 852-2401-1200 fax: 852-2401-3431 australia - sydney tel: 61-2-9868-6733 fax: 61-2-9868-6755 china - beijing tel: 86-10-8569-7000 fax: 86-10-8528-2104 china - chengdu tel: 86-28-8665-5511 fax: 86-28-8665-7889 china - chongqing tel: 86-23-8980-9588 fax: 86-23-8980-9500 china - hangzhou tel: 86-571-2819-3187 fax: 86-571-2819-3189 china - hong kong sar tel: 852-2401-1200 fax: 852-2401-3431 china - nanjing tel: 86-25-8473-2460 fax: 86-25-8473-2470 china - qingdao tel: 86-532-8502-7355 fax: 86-532-8502-7205 china - shanghai tel: 86-21-5407-5533 fax: 86-21-5407-5066 china - shenyang tel: 86-24-2334-2829 fax: 86-24-2334-2393 china - shenzhen tel: 86-755-8203-2660 fax: 86-755-8203-1760 china - wuhan tel: 86-27-5980-5300 fax: 86-27-5980-5118 china - xian tel: 86-29-8833-7252 fax: 86-29-8833-7256 china - xiamen tel: 86-592-2388138 fax: 86-592-2388130 china - zhuhai tel: 86-756-3210040 fax: 86-756-3210049 asia/pacific india - bangalore tel: 91-80-3090-4444 fax: 91-80-3090-4123 india - new delhi tel: 91-11-4160-8631 fax: 91-11-4160-8632 india - pune tel: 91-20-2566-1512 fax: 91-20-2566-1513 japan - osaka tel: 81-66-152-7160 fax: 81-66-152-9310 japan - yokohama tel: 81-45-471- 6166 fax: 81-45-471-6122 korea - daegu tel: 82-53-744-4301 fax: 82-53-744-4302 korea - seoul tel: 82-2-554-7200 fax: 82-2-558-5932 or 82-2-558-5934 malaysia - kuala lumpur tel: 60-3-6201-9857 fax: 60-3-6201-9859 malaysia - penang tel: 60-4-227-8870 fax: 60-4-227-4068 philippines - manila tel: 63-2-634-9065 fax: 63-2-634-9069 singapore tel: 65-6334-8870 fax: 65-6334-8850 taiwan - hsin chu tel: 886-3-5778-366 fax: 886-3-5770-955 taiwan - kaohsiung tel: 886-7-213-7828 fax: 886-7-330-9305 taiwan - taipei tel: 886-2-2508-8600 fax: 886-2-2508-0102 thailand - bangkok tel: 66-2-694-1351 fax: 66-2-694-1350 europe austria - wels tel: 43-7242-2244-39 fax: 43-7242-2244-393 denmark - copenhagen tel: 45-4450-2828 fax: 45-4485-2829 france - paris tel: 33-1-69-53-63-20 fax: 33-1-69-30-90-79 germany - munich tel: 49-89-627-144-0 fax: 49-89-627-144-44 italy - milan tel: 39-0331-742611 fax: 39-0331-466781 netherlands - drunen tel: 31-416-690399 fax: 31-416-690340 spain - madrid tel: 34-91-708-08-90 fax: 34-91-708-08-91 uk - wokingham tel: 44-118-921-5869 fax: 44-118-921-5820 worldwide sales and service 10/26/12


▲Up To Search▲   

 
Price & Availability of 93C86

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X